ET5441
Permabond ET5441 is a thixotropic, thermally conductive two-part epoxy adhesive. It is designed for bonding metal substrates where high-temperature resistance is required and also adheres to carbon fiber, GRP, FRP and selected plastics. The cured product resists motor oil, glycol and hot and cold water and has a thermal conductivity of 1.1 W/(m.K).
For UAV thermal management, ET5441 can bond and thermally seal battery assemblies, motor controllers and high-power electronics. Its thermal conductivity supports heat-transfer interfaces between compatible components and housings, with high-temperature and chemical resistance for demanding electronics installations.
Specifications:
| Color | Part A: White; Part B: Dark grey |
| Viscosity | Thixotropic paste |
| Gap | 2.0 mm (0.08 in) |
| Handling Time | 8 hr |
| Shear Strength (Steel) | 20 to 25 N/mm² (2,900 to 3,630 psi) |
| Temperature Range | -40 to 200°C (-40 to 390°F) |
| Packaging | 10 x 50 mL dual cartridges; 6 x 400 mL dual cartridges |
