Jetson Engineering Kits
D131OXB/D131ONB dimensions refer to the engineering-kit assembly with stand, excluding antennas. Cameras, modules and accessory contents depend on the selected kit configuration.
AVerMedia’s Jetson engineering kits provide accessible development platforms for evaluating AGX Orin, Orin NX and Orin Nano designs. The range combines carrier-board connectivity with cooling and development hardware, allowing OEMs and system integrators to assess camera interfaces, storage and peripheral connections before selecting a production configuration.
D315AO and D315AO-1 provide AGX Orin platforms with Gigabit and 10 Gigabit Ethernet. D317AO adds a modular expansion approach and dual NVMe slots. D131 kits offer Orin NX or Orin Nano options with different camera arrangements. Manuals, BSP downloads and mechanical drawings provide resources for hardware and software development.
Specifications:
| Kit | Dimensions and weight | Jetson platform | Key interfaces |
| D315AO | 141.5 × 133.5 × 63 mm; 720 g |
AGX Orin 32GB/64GB | GbE + 10GbE; PCIe; 120-pin camera interface |
| D315AO-1 | 141.5 × 133.5 × 63 mm; 720 g |
AGX Orin / Industrial | GbE + 10GbE; M.2 cellular; 120-pin camera interface |
| D317AO | 92 × 107 mm footprint; 1 kg, both provisional |
AGX Orin / Industrial | Dual NVMe; GMSL-board connection; optional expansion boards |
| D131LOX / D131LON | 113 × 101.4 × 57.8 mm; 220 g |
Orin NX / Orin Nano respectively | 1 × two-lane MIPI; GbE; 4 × USB Type-A |
| D131OXB / D131ONB | 157 × 105 × 85 mm with stand; 415 g |
Orin NX / Orin Nano respectively | 2 × two-lane + 1 × four-lane MIPI; GbE; 4 × USB Type-A |
