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This compatibility with all three modules means that Connect Tech’s customers can rapidly deploy designs to the field and swap out modules without requiring any product redesign. As with the Jetson Nano and Xavier NX modules, the Jetson TX2 NX will not come supplied with any integrated thermal solution, and Connect Tech will offer thermal transfer plates, active heat sinks, and passive heat sinks.
Connect Tech’s carrier boards for the NVIDIA Jetson TX2 NX module include:
Boson for FRAMOS – integrates up to four MIPI cameras within an extremely small footprint. Specifically designed for use within the FRAMOS Sensor Ecosystem, Boson maximizes sensor inputs and storage solutions for high-end vision applications.
Quark – an ultra-compact and feature-rich carrier board designed for edge computing AI applications such as computer vision, inference, and unmanned systems. The Quark carrier features positive locking IO connectors for rugged environments.
Photon – designed specifically to support smart camera applications. Power and I/O design allow this board to be placed easily into off-the-shelf camera housings. Both PoE (power over Ethernet) and non-PoE options are available, with a variety of thermal solutions.
Connect Tech can customise all three carrier boards to specific customer I/O needs, with both small and large batch manufacturing services available.














