Cinch Connectivity Introduces New PCB Compression Connectors

By Mike Ball / 24 Nov 2020
Follow UST

Cinch PCB connectorsCinch Connectivity Solutions has introduced a new line of SMP and SMPM vertical launch PCB compression connectors, featuring an innovative solderless design that provides excellent RF performance.

The connectors are available in both common microwave transmission line formats (Microstrip and Stripline) and are ideal for applications such as UAV (unmanned aerial vehicle) MIMO radios and active antennas.

The new connectors are screw-mount and solderless, allowing for quick and easy mounting and removal on PC boards. They provide excellent electrical performance, with a maximum VSWR of 1.50 out to 65 GHz and insertion loss of 0.12 √F dB Max (F in GHz).

The connectors are designed to suit various PCB materials and thicknesses, and the vertical launch design reduces footprint requirements without sacrificing performance, resulting in design and installation versatility and convenience.

Posted by Mike Ball Mike Ball is our resident technical editor here at Unmanned Systems Technology. Combining his passion for teaching, advanced engineering and all things unmanned, Mike keeps a watchful eye over everything related to the unmanned technical sector. With over 10 years’ experience in the unmanned field and a degree in engineering, Mike’s been heading up our technical team here for the last 8 years. Connect & Contact
Latest Articles
gNext & Skydio Optimize Bridge Inspection gNext Labs has released an article discussing how Stanec leveraged its drone inspection platform and Skydio autonomous drones to optimize... 25 Sep 2023
Autonomous Hybrid Agricultural Vehicle Launched Robotics Plus’ Prospr is an autonomous, multi-use, hybrid vehicle designed to carry out a variety of orchard and vineyard crop tasks more efficiently and sustainably while reducing reliance on labor 25 Sep 2023
New Multi-Platform Mobile LiDAR Mapping Solution CHC Navigation's AlphaUni 20 is compact and lightweight and features an advanced multi-target capability supporting up to 16 target echoes 25 Sep 2023
Improved TXV640 Thermal Camera Core Unveiled Upgraded features on BAE Systems' TWV640 include contrast enhancement, field pixel kill, and improved Noise Equivalent Temperature Difference (NETD) 25 Sep 2023
UXV Technologies & Rheinmetall Canada: A Partnership History The extraordinary collaboration between UXV Technologies and Rheinmetall Canada has spanned more than four years, and continues to push the boundaries... 25 Sep 2023
Software Platform for Drone Flight Planning, Management & Community Integration The AirHub Platform helps drone pilots, government, and business stakeholders to plan and optimize their operations while prioritizing safety 25 Sep 2023
Featured Content
Registration Open for the Airborne ISR Conference 2023 The 8th Annual Airborne ISR Conference is set to return on 18 - 19 October 2023 in London, with a key focus on effective Airborne ISR capabilities 19 Sep 2023
Defense Advancement Collaborates with BAE Systems Digital Intelligence to Deliver Land Domain Advantage New collaboration announced at DSEI 2023 aims to accelerate the development of, and extend capabilities in, the Land Domain through SME engagement 14 Sep 2023
EchoBlue to Showcase Innovative Defense Technology Marketplace at DSEI The EchoBlue team will be showcasing UnmannedSystemsTechnology.com and the defense-focused platform, DefenseAdvancement.com at DSEI 2023 in London, 12-15 September on stand H1-267 07 Sep 2023