San Francisco Circuits highlights ENEPIG, the advanced Printed Circuit Board (PCB) surface finish advancing electronic interconnection technologies. This metal coating delivers impressive reliability, seamlessly addressing complex manufacturing challenges while providing superior protection for mission-critical electronic assemblies.
ENEPIG surface finish.
ENEPIG has emerged as a premier PCB coating technique, distinguished by competitive palladium rates and significant technological benefits compared to alternative treatments. Comprising a sophisticated multilayer metal structure – copper base, nickel intermediate, palladium transition, and gold top coat – this innovative finishing provides superior corrosion resistance and effectively mitigates the problematic “dark pad” phenomenon.
Ideal for Demanding Requirements
Accommodating diverse mounting technologies, ENEPIG excels across multiple package configurations: ball grid arrays, surface-mount components, wire bond connections, and press-fit implementations. Its ultrathin auric stratum (0.05μm – 0.1μm) facilitates streamlined manufacturing processes while delivering enhanced durability and extended operational longevity.
ENEPIG Capabilities
- Eliminates Metallurgical Bonding Defects
- Demonstrates Superior Structural Integrity
- Provides Economical Manufacturing Solution
- Meets Stringent Environmental Regulations
- Ensures Outstanding Interconnection Performance
Applications
ENEPIG represents the essential solution for sophisticated multilayer printed circuit boards, intricate high-density assemblies, and mission-critical sectors including military, medical, aerospace, and advanced technological equipment manufacturing.
