San Francisco Circuits knows that designing a printed circuit board (PCB) that hits all performance targets is no small task – but the challenge grows significantly when multiple interconnected boards are involved. Read more >>
San Francisco Circuits, as a provider of advanced PCB solutions, highlights key considerations to streamline multi-board development without compromising on reliability or functionality.
In multi-board systems, signal integrity, mechanical fit, and interconnect strategy become critical. Early planning is essential—accounting for connector placement, board stacking, and alignment can help avoid design rework and integration delays. The more boards involved, the greater the risk of cumulative tolerances and electrical mismatches impacting overall system performance.
In this article, San Francisco Circuits explores:
- Examples of Multi-Board Solutions
- Basic Design Considerations for Robust Interconnectivity
- Following a PCB Design Workflow
- Board Stacking Considerations
- Think Ahead to PCB Testing
- Keep Manufacturing & Servicing in Mind
- Designing for Effective High-Speed Interconnectivity
By building strong relationships with knowledgeable vendors and maintaining disciplined workflows, engineers can better manage the complexity of multi-board assemblies—transforming a daunting process into a more predictable, repeatable design cycle.
Read the original article, or visit SFC’s website for more information.
