Windform® SL is a carbon-fiber-reinforced polyamide composite developed by CRP Technology for Selective Laser Sintering (SLS). With an ultra-low density of 0.87 g/cc, it delivers outstanding mechanical performance without compromising structural integrity. Its high tensile modulus of 4033 MPa and tensile strength of 52.82 MPa make it ideal for UAV components where weight savings and rigidity are paramount.
Engineered for aerospace-grade thermal stability, Windform® SL boasts a Heat Deflection Temperature (HDT) of 182.5 °C at 1.82 MPa, ensuring consistent performance in high-temperature environments. Its impact resistance and excellent surface finish—achieving Ra values as low as 0.83 µm after CNC machining—make it suitable for both functional and aesthetic applications.
