Extreme Engineering Solutions’ (X-ES) XPedite2770 is a cutting-edge 3U VPX FPGA module designed for high-performance signal processing, data security, and complex computing applications.
Powered by the AMD (formerly Xilinx) Versal® Prime Adaptive Compute Acceleration Platform (ACAP), the XPedite2770 delivers exceptional versatility and reconfigurability. This module’s conduction-cooled design ensures reliable operation in challenging environments, making it well-suited for defense, aerospace, and telecommunications applications.
XPedite2770
The XPedite2770 features a heterogeneous computing platform with two ARM® Cortex®-A72 processor cores, two ARM® Cortex®-R5F real-time processor cores, a large FPGA fabric, and an efficient Network-on-Chip (NoC) interconnect.
These elements enable high-performance computing for demanding tasks such as signal processing, packet processing, sensor I/O, DSP-intensive applications, 5G wireless infrastructure, cloud computing, and advanced aerospace and defense systems.
High-Speed Connectivity & Storage
The XPedite2770 is equipped with high-speed interfaces to support bandwidth-intensive operations. It features two x4 PCI Express interfaces, providing high-speed data transfer capabilities crucial for real-time applications. Additionally, the module includes two 10/100/1000BASE-T Ethernet ports, allowing seamless network integration and communication with other devices.
The module supports up to 256 GB of onboard NAND flash storage and features multiple I/O ports, including LVDS, single-ended GPIO, and RS-232/422/485 serial connectivity through backplane connectors.
Expansion Capabilities with XMC Site
The XPedite2770 provides additional expansion options through its integrated XMC site, allowing for increased flexibility in system configurations. This XMC site includes a x8 PCI Express Gen2-capable interface, which can support PCIe Gen3 depending on the user application.
Additionally, the XMC site is equipped with X12d I/O mapped directly to the VPX backplane connectors, ensuring seamless compatibility with system backplanes.
Block Diagram
FPGA & Processing Power
The XPedite2770 is optimized for high-performance logic and DSP applications, making it an ideal choice for compute-intensive operations. At its core, the module features the AMD Versal® Prime VM1402 ACAP, a powerful and flexible processing platform. It includes a dual-core ARM® Cortex®-A72 processor, which is equipped with 48 KB/32 KB L1 cache with parity and ECC, as well as a 1 MB L2 cache with ECC.
Additionally, the module features a dual-core ARM® Cortex®-R5F processor, which includes a 32 KB/32 KB L1 cache and a 256 KB TCM with ECC. These processing elements work together to provide a robust and scalable computing solution capable of handling complex workloads efficiently.
Memory & Storage
To support data-intensive applications, the XPedite2770 is equipped with high-speed memory and storage solutions. It features 16 GB of LPDDR4 ECC SDRAM in a two-channel configuration, ensuring optimal memory bandwidth for demanding tasks. The module also supports up to 256 GB of NAND flash storage, providing ample space for data storage and logging applications. The module includes 4 Gbit of QSPI FPGA configuration flash, allowing for rapid FPGA configuration and reprogramming.
Versatile I/O Support
The XPedite2770 offers extensive I/O support, ensuring seamless integration with various system architectures.
VPX (VITA 46) P0 I/O
The module includes two IPMB connections to an IPMI controller, allowing for remote monitoring and management of system health and performance.
VPX (VITA 46) P1 I/O
For high-speed connectivity, the XPedite2770 features two 10GBASE-R Ethernet ports, providing fast data transfer rates for network-intensive applications. It also includes a x4 PCI Express Gen3-capable interface to P1.A, along with a x4 PCI Express Gen2-capable interface to P1.B, which can support PCIe Gen3 depending on the user application. Additionally, the module supports XMC P16 I/O, mapping P1w9-X12d per VITA 46.9, allowing for flexible system configurations.
VPX (VITA 46) P2 I/O
The module provides additional connectivity options with two 10/100/1000BASE-T Ethernet ports, ensuring reliable network communication. It also includes six LVDS GPIO, enabling high-speed data transmission for various applications. Furthermore, the module features a x1 High-Speed Serial (HSS) interface, which can support PCIe Gen3 or SATA, depending on the user application.
Additionally, the XPedite2770 includes one RS-232/422/485 serial port, providing compatibility with a wide range of legacy and modern communication protocols. A build option is available for eight LVDS and 16 SE GPIO from the FPGA, or XMC P16 I/O mapping P2w9-X16s+X8d, allowing for further customization to meet specific application requirements.
SOSA Compatibility & Physical Characteristics
The XPedite2770 is designed to align with modern defense and aerospace standards, ensuring seamless integration into existing system architectures. It features a SOSA-aligned pinout that is compatible with backplane slot profile SLT3-PAY-1F1F2U1TU1T1U1T-14.2.16, providing interoperability with a wide range of VPX systems. Additionally, the module supports the SOSA-aligned AMPS profile MODA3-16.2.15-1-F2C-(P3F)(P2F)(2E7-E3)(N-N-N-N-M3/M4/M5-N), ensuring compliance with industry standards.
The XPedite2770 is available in a 3U VPX-REDI conduction- or air-cooled form factor, making it suitable for deployment in harsh environments. Its dimensions are 100 mm x 160 mm, with a 0.8-inch pitch without a solder-side cover, and options for 0.85-inch and 1.0-inch pitch with a solder-side cover and Two-Level Maintenance (2LM) support. These physical characteristics make the XPedite2770 a durable and versatile solution for demanding military and aerospace applications.
Streamlined Development with X-ES HMDK
To facilitate rapid development and deployment, X-ES provides the Hardware Manager Development Kit (HMDK), a comprehensive suite of tools and resources. The HMDK includes Linux Yocto support, ensuring compatibility with embedded software environments. It also provides a pre-validated environment featuring a library of optimized IP, software components, and design resources.
The Hardware Manager application, Arm Trusted Firmware (ATF), U-Boot bootloader, FPGA Development Kit (FDK), and example designs tailored for the XPedite2770 further streamline development efforts. By offering a robust development ecosystem, X-ES enables engineers to quickly design, test, and deploy customized solutions leveraging the powerful capabilities of the XPedite2770.
