Teledyne FLIR Introduces New ROIC Devices

By Mike Ball / 29 Dec 2021
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Teledyne FLIR ROIC DevicesTeledyne FLIR has launched a new line of 10-micron pitch readout integrated circuit (ROIC) devices for infrared imaging. The ISC1504, ISC1901, and ISC1902 join the lineup of near-infrared (NIR), mid-wavelength infrared (MWIR), and long-wavelength infrared (LWIR) devices in off-the-shelf ROIC solutions designed for wide range of applications ranging from academic research to military infrared systems in UAVs (unmanned aerial vehicles) and unmanned systems.

At 1920 x 1080 resolution, the ISC1504 is the largest format ROIC offered by Teledyne FLIR optimized for InGaAs/VisGaAs detectors and uses a capacitive trans-impedance amplifier (CTIA) input circuit for P-on-N detectors. The ISC1504 supports anti-blooming, input skimming, multiple integration modes, and selectable output modes. A simple user interface with analog outputs allows for easy integration into high-resolution systems.

The ISC1901 (2048 × 1536 resolution) and the ISC1902 (2048 × 2048 resolution) are designed for P-on-N detectors with a direct injection input circuit. Both support single sample or sub-frame averaging for effective well fill of 3M to 19M electrons, respectively. The setting selections allow the user to control various modes such as 2 × 2 binning, 8 or 16 output channels, and additional reverse bias for Quantum Well Infrared Photodetector (QWIP) detectors. The familiar user interface makes system integration straightforward.

All ROIC devices are probe tested and delivered in wafer form with test data, a user’s guide describing all electrical interfaces, and a mechanical interface database providing the layout information for bump and detector interfaces. With low noise, variable charge storage capacitance, selectable integration times, adjustable gain and power settings, and a simple user interface, the mixed-signal ROICs offer a proven design that does not sacrifice performance or flexibility. Additionally, Teledyne FLIR offers full custom ROIC design services covering trade study, specification, design, testing, and fabrication of wafers.

Posted by Mike Ball Mike Ball is our resident technical editor here at Unmanned Systems Technology. Combining his passion for teaching, advanced engineering and all things unmanned, Mike keeps a watchful eye over everything related to the unmanned technical sector. With over 10 years’ experience in the unmanned field and a degree in engineering, Mike’s been heading up our technical team here for the last 8 years. Connect & Contact