
The Specialty Coating Systems (SCS) cutting-edge PrecisionCoat VI is a versatile, fully programmable selective conformal coating and dispensing system, offering exceptional programming capabilities for automated material applications.
In addition to providing coatings for drone electronics, the PrecisionCoat utilizes multi-valve technologies for the application of underfill materials, while its potting platform automates the potting process, improving both production accuracy and efficiency. Both underfill and potting serve specific purposes in electronics manufacturing, with distinct application methods.
Underfill Applications
Underfill is a composite material consisting of an epoxy polymer with substantial amounts of filler, along with additives like flow agents, adhesion promoters, and dyes.
Used in sectors such as consumer electronics, semiconductor packaging, automotive, mobile phones, and artificial intelligence, underfill is essential for applications requiring enhanced performance and miniaturization.
Underfill protects electronic devices from shock and thermal cycling, ultimately extending product lifecycles. Though predominantly used in flip-chip devices like handhelds subjected to drop and tumble tests, underfills are also applicable to ball-grid arrays (BGAs). When equipped with the SCS tower jet valve, a PrecisionCoat dispenses underfill along the edge or a corner of a ball grid array (BGA) or device.
The chip and printed circuit board are then heated to a specified temperature, typically between 125°C and 165°C, though this can vary based on the manufacturer. At the recommended temperature, the underfill becomes liquid and flows under the chip.
This provides a strong mechanical bond between the chip and the printed circuit board’s connection, shielding the solder joints from mechanical stress while aiding in heat transfer. Due to the robust bond, rework can be challenging.
Potting Applications
Potting involves a one- or two-part material used to safeguard components from environmental and mechanical damage. Common potting materials include epoxies, silicones, and polyurethanes. These resins serve as both the base and the activator, catalyzing the transformation of liquid materials into solids.
Potting offers electrical insulation, thermal stability, and chemical resistance, making it ideal for high-voltage applications. It is widely used in electronics such as power supplies, switches, ignition coils, electronic modules, motors, connectors, sensors, cable harness assemblies, capacitors, and transformers.
To accommodate different volumes and material types, a pumping system can be employed to measure and dispense the material. This can be done in single or multiple stages to minimize voiding and ensure consistent filling of the device or enclosure. For two-part materials, accurate metering and mixing are required to ensure proper curing.
The PrecisionCoat potting platform can be configured with one or multiple heads for dispensing either one-part or two-part materials. Various dispensing techniques, such as bottom filling, multi-stage fills, or multi-shot applications, can be used to reduce void formation in the cavity.
Potting provides dependable, long-term protection against environmental conditions. However, it does add weight, thickness, and complexity to an electronic assembly, as a housing must be used to contain the potting material. Moreover, two-part compounds may have specialized process requirements, and potting can be challenging to inspect or rework.