3U VPX Processing Module

XPedite2770

Designed to withstand extreme environmental conditions, the conduction-cooled XPedite2770 module integrates high-performance processing, reliable memory architecture, and advanced ruggedization to ensure operational stability in demanding deployments.

Designed for Rugged & Harsh Environments

Built to ruggedization Level 5, the XPedite2770 delivers superior reliability in the most challenging conditions. It meets strict military-grade standards for shock (40g, 11 ms sawtooth), vibration (0.1 g²/Hz, 5 to 2000 Hz), and humidity (up to 95% non-condensing), making it ideal for unmanned aerial, ground, and maritime systems operating in extreme environments.

Its conduction-cooled design efficiently dissipates heat, allowing the module to perform reliably across a wide operating temperature range of -40°C to +85°C, with a storage tolerance of -55°C to +105°C. This ensures sustained processing performance in both arctic and desert conditions.

High-Speed Memory & Secure Storage

The XPedite2770 is equipped with a dual-channel memory architecture, featuring:

• 16 GB of LPDDR4 ECC SDRAM for high-bandwidth processing
• Up to 256 GB of NAND flash for non-volatile data storage
• 4 Gbit of QSPI FPGA configuration flash, ensuring secure boot and programmable logic capabilities

Optimized for Unmanned and Autonomous Platforms

Designed for deployment in SWaP-constrained unmanned systems, the XPedite2770 offers a low-power, high-performance computing solution for applications such as:

• Autonomous vehicle control and sensor fusion
• Mission computing and real-time data processing
• Electronic warfare and secure communications

With its ruggedized architecture, extended environmental tolerance, and high-performance memory, the XPedite2770 is an ideal solution for integrators seeking military-grade embedded computing for unmanned platforms and next-generation defense systems.