Advantech has launched MIC-770 V3, the next generation of its proven MIC-7 series of compact fanless embedded systems. Powered by a cutting-edge 12th/ 13th generation Intel Core i socket-type (LGA1700) processor coupled with Intel R680E/ H610E chipset, MIC-770 V3 delivers excellent computing performance, a wide range of I/O interfaces, and flexible expandability through i-Modules and iDoor technology integration. MIC-770 V3 seamlessly supports EdgeSync 360, enabling remote management for real-time status monitoring and anomaly detection. With its advanced capabilities, MIC-770 V3 serves as a reliable data gateway or industrial controller for edge robotics and AIoT (artificial intelligence of things) applications.
With up to 16 cores and 24 threads, the MIC-770 V3 boasts an over 40% improvement in CPU performance compared to its predecessor. Equipped with the Intel R680E PCH, this system supports dual-channel DDR5-4800 ECC memory, offers up to four independent displays and provides 1 x NVMe PCIe x4 M.2 storage. The socket-type CPU design empowers customers to select the ideal processor for their specific performance requirements, ensuring effortless installation and reliable operation in various industrial application scenarios. The ruggedized construction of MIC-770 V3 supports a wide operating temperature range of (-20 ~ 60 °C) and a wide input voltage of (9 ~ 36 VDC), making it highly suitable for deployment in even the most challenging environments.
To meet the diverse requirements of automation applications, the MIC-770 V3 offers extensive onboard I/O capabilities. This includes 2 x GigaLAN, 2 x USB 3.2 (Gen2), 6 x USB 3.2 (Gen1), and 2 x RS-232/422/485 interfaces, as well as support for up to 4 x independent displays. Furthermore, the system provides enhanced functionality through Advantech’s Flex I/O, iDoor, and i-Module expansion options.
Advantech offers a range of i-Module options to deliver powerful expansion capabilities, including 1-slot, 2-slot, 4-slot, storage, or GPU expansion modules. This flexibility allows customers to fulfill their specific needs, whether it’s adding extra cards, increasing storage capacity, or enhancing computing power. By combining MIC-770 V3 with i-Modules, it can deliver exceptional performance for high-speed data processing, AI inference, deep learning, and other demanding applications.
The modular design of the MIC-770 V3 provides customers with flexibility and convenience. It reduces assembly time on the production line, lowers maintenance expenses in the field, and improves operational efficiency. Additionally, the system ensures reliability across various applications, catering to specific usage requirements.
The MIC-770 V3 is fully compatible with EdgeSync 360, a software solution that facilitates remote management of devices for various industrial applications. By leveraging EdgeSync 360, MIC-770 V3 enables comprehensive access, configuration, monitoring, analysis, and control of all IoT network devices. This eliminates the need for on-site maintenance and reduces system downtime and operational costs. The integration is particularly beneficial for industries such as continuous manufacturing and AI-based edge computing, where system interruptions or failures can lead to significant downtime and productivity losses. This makes it an ideal solution for implementing and expanding AIoT applications, offering a practical and application-oriented approach to meet industry-specific needs.
