New Advanced Video Processor to Power AI at the Edge

Teledyne FLIR’s new AVP incorporates a Qualcomm processor, performing impressively within a low-SWaP module for thermal and visible camera integration into unmanned aerial vehicles By Abi Wylie / 22 Apr 2024
New Advanced Video Processor to Power AI at the Edge
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Teledyne FLIR has launched Teledyne FLIR AVP, the company’s advanced video processor designed to power Teledyne FLIR’s Prism™ AI and computational imaging at the edge.

The AVP incorporates the latest Qualcomm QCS8550, Teledyne FLIR’s most advanced mobile processor chip from a leading producer of mobile, automotive, and robotics system-on-chip (SoC) technology. 

The AVP provides impressive artificial intelligence (AI) performance within a small, lightweight, and low-power embedded module for thermal and visible camera integration into unmanned aerial vehicles, robots, small gimbals, handheld devices, and fixed-mounted security systems.  

AVP runs the Teledyne FLIR Prism AI and ISP software libraries and interfaces with the Boson® and Neutrino® thermal infrared imaging camera modules and a wide range of popular visible cameras. 

Trained on a large thermal image data lake of more than 5 million annotations, Prism AI is a powerful perception software designed to detect, classify, and track targets or objects for automotive autonomy, automotive automatic emergency braking, airborne camera payloads, counter-drone systems, ground intelligence, surveillance and reconnaissance (ISR), and perimeter security. 

Prism ISP is a comprehensive set of image processing algorithms that include super resolution, image fusion, atmospheric turbulence removal, electronic stabilization, local-contrast enhancement, and noise reduction. 

The AVP is designed to empower integrators to build powerful, edge-intelligent products. It is supported by several tools to simplify and streamline development including a Qualcomm RB5 development kit. Software and board-support packages are also available to enable developers to design and fabricate custom interface boards that meet each product’s specific form, fit, function, and input-output (IO) requirements.

Dan Walker, Vice President of Product Management at Teledyne FLIR, said; “The new AVP is the most powerful and SWaP-optimized processor on the market today, running AI workloads up to five times faster than competitive offerings. 

“The combination of powerful edge computing and our Prism digital solutions ushers in a new era of electro-optical system capabilities while simplifying development and reducing integration risk.”  

Posted by Abi Wylie Connect & Contact