congatec Mini Computer-on-Module Specification Approved

The pinout and footprint of the Mini Computer-on-Module specification have been approved by the the PICMG COM-HPC technical subcommittee By Mike Ball / 19 Dec 2022
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congatec COM-HPC Minicongatec has confirmed that the PICMG COM-HPC technical subcommittee has approved the pinout and footprint of the company’s new credit-card-sized (95x60mm) high-performance COM-HPC Mini Computer-on-Module specification. The new COM-HPC Mini standard is now entering the home stretch towards final ratification, which is scheduled for the first half of 2023.

Designed for small but performance-intensive applications, the new COM-HPC Mini specification will open up the prospect of developing ultra-powerful microcomputers the size of a 4- or 8-port Ethernet switch. Target markets include embedded and edge computing applications such as rugged unmanned systems and robotics platforms.

Soldered RAM is a standard feature of these modules. Processors predestined for this new form factor are the 12th Gen Intel Core processor series – for which congatec already offers a ready-to-deploy design study for initial lab tests and customer feedback loops – and its future successors.

Providing 400 pins, as compared to COM Express Mini’s 220 pins, the new COM-HPC Mini standard is designed to satisfy the rising interface needs of heterogeneous and multi-functional edge computers. Extensions include up to 4x USB 4.0 with full functionality including Thunderbolt and DisplayPort alternate mode, PCIe Gen 4/5 with up to 16 lanes, 2x 10 Gbit/s Ethernet port and much more. The COM-HPC Mini connector is qualified for bandwidths of more than 32 Gbit/s – enough to support PCIe Gen 5 or even Gen 6.

Christian Eder, director of product marketing at congatec, and chairman of the COM-HPC working group, commented: “The pinout approval is an essential milestone as carrier board designers and Computer-on-Module manufacturers such as congatec who are active in the COM-HPC working group can now embark on first compliant small form factor sized embedded and edge computer solutions based on this pre-approved data. The goal is to bring modules to market at the same time as Intel and other application processor vendors launch their new high-end processor generations, which is expected to happen next year.”

Posted by Mike Ball Mike Ball is our resident technical editor here at Unmanned Systems Technology. Combining his passion for teaching, advanced engineering and all things unmanned, Mike keeps a watchful eye over everything related to the unmanned technical sector. With over 10 years’ experience in the unmanned field and a degree in engineering, Mike’s been heading up our technical team here for the last 8 years. Connect & Contact