Embedded Computing Solutions, Computer-on-Modules & Single-Board Computers for Drones & UAV

congatec Mini Computer-on-Module Specification Approved

The pinout and footprint of the Mini Computer-on-Module specification have been approved by the the PICMG COM-HPC technical subcommittee By Mike Ball / 19 Dec 2022

congatec COM-HPC Minicongatec has confirmed that the PICMG COM-HPC technical subcommittee has approved the pinout and footprint of the company’s new credit-card-sized (95x60mm) high-performance COM-HPC Mini Computer-on-Module specification. The new COM-HPC Mini standard is now entering the home stretch towards final ratification, which is scheduled for the first half of 2023.

Designed for small but performance-intensive applications, the new COM-HPC Mini specification will open up the prospect of developing ultra-powerful microcomputers the size of a 4- or 8-port Ethernet switch. Target markets include embedded and edge computing applications such as rugged unmanned systems and robotics platforms.

Soldered RAM is a standard feature of these modules. Processors predestined for this new form factor are the 12th Gen Intel Core processor series – for which congatec already offers a ready-to-deploy design study for initial lab tests and customer feedback loops – and its future successors.

Providing 400 pins, as compared to COM Express Mini’s 220 pins, the new COM-HPC Mini standard is designed to satisfy the rising interface needs of heterogeneous and multi-functional edge computers. Extensions include up to 4x USB 4.0 with full functionality including Thunderbolt and DisplayPort alternate mode, PCIe Gen 4/5 with up to 16 lanes, 2x 10 Gbit/s Ethernet port and much more. The COM-HPC Mini connector is qualified for bandwidths of more than 32 Gbit/s – enough to support PCIe Gen 5 or even Gen 6.

Christian Eder, director of product marketing at congatec, and chairman of the COM-HPC working group, commented: “The pinout approval is an essential milestone as carrier board designers and Computer-on-Module manufacturers such as congatec who are active in the COM-HPC working group can now embark on first compliant small form factor sized embedded and edge computer solutions based on this pre-approved data. The goal is to bring modules to market at the same time as Intel and other application processor vendors launch their new high-end processor generations, which is expected to happen next year.”

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Posted by Mike Ball Mike Ball is our resident technical editor here at Unmanned Systems Technology. Combining his passion for teaching, advanced engineering and all things unmanned, Mike keeps a watchful eye over everything related to the unmanned technical sector. With over 10 years’ experience in the unmanned field and a degree in engineering, Mike’s been heading up our technical team here for the last 8 years. Connect & Contact