TE Connectivity has introduced a new solution that provides a controlled and reliable solder joint for low outgassing space applications. The SolderSleeve is designed to meet the demands of the space industry, which requires minimal to zero foreign object damage (FOD), and is ideal for applications such as low earth orbit (LEO) satellites and unmanned spacecraft.
The SolderSleeve interconnection device is designed for fast and convenient installation, with the durability to perform in harsh environments and the versatility for varied applications in the space domain. The product can be used in splicing wires and shield terminations, and employs heat shrinkable technology that allows it to connect, insulate and protect in one step. The solution is made with a transparent insulation sleeve, rated up to 150 degrees Celsius, and has a tensile strength of up to 15 pounds.
Ujjwal Varma, product manager for TE’s Aerospace, Defense and Marine division, commented: “TE’s SolderSleeve interconnection device for space offers an ideal solution for high reliability, reduced SWaP and environmentally protected shield termination on cables that help insulate, protect and provide strain relief at the same time. Our inhouse design and quality-controlled process offers complete reliability and traceability for our products.”
The product requires minimal tools for installation, and is tested and qualified for low outgassing parameters, which are in line with TE specification 108-160024, ASTM E-595 (ECSS-Q-ST-70-02C) and RT-1404.