FLIR Systems has launched what it claims is the industry’s first dual thermal and visible imaging sensor module for OEMs of drones and robotic systems. The low-SWaP (size, weight and power) FLIR Hadron is designed to reduce development cost and improve time to market for new product developments, and combines a 12-megapixel visible camera with the FLIR Boson 320×240 thermal camera, featuring a framerate of up to 60 Hz.
During the Hadron development process, FLIR worked closely with drone manufacturers Vantage Robotics and Teal Drones, in order to optimize the system for lightweight UAV airframes. Vantage Robotics integrated Hadron into its micro-gimbal platform with proprietary stabilization technology, resulting in a dual-sensor OEM solution for existing UAS as well as other robotic vehicles. Teal has used Hadron to create a compact, dynamic payload for its 2-pound (1 kilogram) Golden Eagle small UAS platform, taking advantage of the module’s low SWaP footprint to minimise battery usage and maximise flight time.
Paul Clayton, General Manager, Components Business at FLIR, commented: “With the introduction of Hadron, FLIR Systems is leading the way in offering low-cost, dual sensor integration across a variety of industries from commercial drones to industrial imaging systems. Although our unmanned aerial system (UAS) customers are first to market with Hadron, this product empowers all of our OEM customers to increase performance with out-of-the-box functionality and simplified integration.”
Tobin Fisher, CEO at Vantage Robotics, said: “Hadron is far and away the lightest and smallest combined visible-thermal sensor that has ever been commercially available. For an aircraft where you’re trying to push the limit on flight performance, every gram matters. The ability to get these sensor capabilities in a package this small makes an enormous difference.”
George Matus, Teal Drones CEO and founder, stated: “Hadron enables us to speed development and time-to- market for small airframes with thermal and visual sensors. Its high quality, low weight, and compact size allows for rapid integration to quickly develop prototypes.”