Technology Advancement Group, Inc. (TAG®) has been issued a US patent (8,537,540) for a Field Serviceable CPU Module.
TAG has deployed this Field-Upgradable CPU™ technology in a rugged Smart Display/Panel-PC and Rugged Small Form Factor (SFF) Computer, and plans to extend this technology across other product platforms in order to provide a highly flexible option for military operations deployed in remote locations.
This is the thirteenth U.S. patent granted to TAG, and the second patent developed by Trevor Landon (Vienna, VA) that will help strengthen TAG’s patent portfolio. The patent covers a removable computer module heat sink assembly that forms a water and air tight seal when attached to the computer chassis and mated to the baseboard component through an internal compartment of the chassis. The computer module heat sink assembly is easily removed or attached to the computer chassis, providing a quick method for servicing or upgrading an integral component of rugged computer systems.
“TAG’s out-of-the-box thinking has helped us produce an innovative patented technology ensuring a strong commitment to research and development,” said Trevor Landon, TAG’s Vice President of Research and Development. “Improvements in the computer systems architecture will greatly improve the service men and women’s ability to upgrade the units’ computer modules.
TAG is an Information Technology (IT) firm that designs and manufactures rugged computer systems, builds the US Army approved Precise Positioning Services (PPS) Global Positioning Systems (GPS) Surveying System (PGSS), provides security-cleared staffing solutions, and delivers global communication network services.