San Francisco Circuits (SFC), a provider of PCB (printed circuit board) fabrication, assembly and test services for unmanned systems and robotic platforms, has released an in-depth article outlining the critical information needed to select the right surface finish for particular PCB applications.
A surface finish is essential for making a reliable connection between the PCB and its electronic components, providing a solderable surface for attaching components to the PCB, as well as protecting any exposed copper from oxidizing.
The article details the advantages, disadvantages, properties and common applications for the following PCB surface finish technologies:
- ENIG (Electroless Nickel Immersion Gold)
- ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold)
- Electrolytic Nickel/Gold – Ni/Au (Hard/Soft Gold)
- Immersion Silver
- White Tin/Immersion Tin
- OSP (Organic Solderability Preservatives)
- Lead Free HASL (Hot Air Solder Leveling)
Selecting the right PCB surface finish for a particular application is crucial for maximising performance and reliability. A wide variety of factors need to be considered, such as cost, environmental conditions (temperature, shock, vibration, RF), component density, and production volume. To find out more, read the full article here.