Unmanned Systems News

Article: New Technology Developments in Microelectronics

Published: 10 Sep 2020 by

San Francisco Circuits microelectronics designSan Francisco Circuits (SFC), a provider of PCB (printed circuit board) fabrication, assembly and test services for unmanned systems and robotic platforms, has released an article detailing new technology advances in microelectronics. As PCB packages keep getting smaller, and new electronic designs demand denser circuit boards, precision in microelectronics becomes even more important. Proper use of microelectronics best-practices in PCB production, including design, layout, fabrication and PCB assembly, ensures that devices will function well even with reduced form factors.

Read the full article on San Francisco Circuits’ website

The article covers:

  • Facets of traditional designs such as plated through-hole (PTH) components and surface mount technology (SMT)
  • Ball grid array (BGA) packages and microvias
  • Connectors in through-hole technologies, such as USB-C
  • High density interconnects (HDI) and design considerations for achieving thin linewidths
  • Typical implementations of microvias in eight-layer PCBs

To find out more about modern microelectronics and future-proofing PCB designs to keep up with changing trends in PCB size and density, read the full article on SFC’s website here.

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Posted by Mike Ball Mike Ball is our resident technical editor here at Unmanned Systems Technology. Combining his passion for teaching, advanced engineering and all things unmanned, Mike keeps a watchful eye over everything related to the unmanned technical sector. With over 10 years’ experience in the unmanned field and a degree in engineering, Mike’s been heading up our technical team here for the last 8 years. Connect & Contact