This new resource includes all relevant stack-up details that should be included and provides examples for MCPCBs, HDIPCBs, RF PCBs, Flex PCBs, and Rigid-Flex PCB stack-ups.
Other stack-up requirements that are covered include PCB lamination methods, board type and application, board component density, component types and interfaces, and mechanical requirements.
This guide has been put together by the experts at San Francisco Circuits to help readers with creating the perfect balance between cost, availability, and performance with their PCB stack-up.
