San Francisco Circuits helps designers push the limits of miniaturization with double-sided Ball Grid Array (BGA) assembly, enabling high-density PCBs that maximize functionality without increasing board size.
This technology is particularly valuable for unmanned systems, from drones to autonomous ground vehicles, where space and weight are at a premium. By placing components on both sides of the board, engineers can integrate advanced sensors, processors, and communication modules while keeping platforms compact and lightweight.
High-density BGAs also enhance reliability in challenging environments. Using high-Tg substrates, optimized reflow processes, and precision assembly techniques, these compact boards withstand the thermal stress, vibration, and mechanical shocks common in unmanned operations.
The space savings offered by double-sided BGAs allow for more complex electronics, from AI processors for autonomous navigation to multi-sensor arrays for real-time situational awareness. This combination of miniaturization and performance is crucial for next-generation unmanned systems.
Automated inspection and testing further guarantee consistency, making double-sided BGA boards ideal for scalable production of unmanned fleets. San Francisco Circuits’ expertise ensures engineers can build smaller, smarter, and more capable unmanned platforms without compromise.
Read more about double-sided BGA assembly on San Francisco Circuits’ website.
