D3 Engineering, a provider of embedded electronics technologies, has announced a new DesignCore Development Kit based around the TDA4VM system-on-chip (SoC) processor from Texas Instruments (TI). The DesignCore RVP-TDA4Vx development kit features a rugged ECU (electronic control unit) and is ideal for ADAS (advanced driver-assistance systems) development as well as autonomous vehicle and drone applications such as deep learning, neural networks, object identification and tracking, and sensor fusion (camera, radar, ultrasonic, and LiDAR). The development kit is intended to progress designs through to production level.
The TDA4VM SoC processor board includes an internal Image Signal Processor (ISP) and is optimized for automotive temperature ranges and environmental conditions. The configurable baseboard with personality card supports multiple SerDes capture streams with different transport protocols, with the default card supporting eight 4Gbps FPD-Link III channels.
The video outputs feature FPD-Link III technology and Display Port MST technology, supporting up to 4 serial displays. The system supports Hardware-in-the-Loop architectures via a CSI2-TX port. The baseboard also has an expansion interface, multiple connectivity options, and an automotive power design with reverse battery protection. The kit’s ECU has a rugged enclosure for on-vehicle testing.
The supplied firmware and software include D3’s advanced vision software framework and TI’s Processor SDK RTOS Automotive (PSDKRA) and Processor SDK Linux Automotive (PSDKLA). The software packages together form a multi-processor software development platform, providing a comprehensive set of software tools and components to help users develop and deploy their applications. Both PSDKLA and PSDKRA can be used together to implement various automotive use-cases.
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