Dymax will be exhibiting its light-curing materials and equipment designed to address key electronics assembly challenges at SMTA International 2025 in Rosemont, Illinois, from October 21–23.
The global manufacturer plans to showcase its solutions for protecting components from harsh environments, meeting regulatory requirements, and streamlining assembly workflows.
A focus of the display will be the company’s TPO-free UV/LED-curable materials, including the 9501-F-Z adhesive and the 7501-T-UR-SC-Z coating. These products are formulated without Trimethylbenzoyl Diphenylphosphine Oxide (TPO) to support compliance with evolving regulations and meet customer demand for TPO-free options in battery and Printed Circuit Board (PCB) assemblies.
Additional products on display will include the 9483 and 9451 conformal coatings, alongside the SpeedMask® 9-20479-B-REV-A maskant. These products are designed to protect PCBs and critical electronics against heat, corrosive chemicals, and moisture during both processing and component life usage.
Regarding assembly equipment, Dymax will showcase the BlueWave® QX4 V2.0 LED spot-curing system, which is intended to reduce cycle times and increase throughput through fast, precise curing in targeted areas. A PVA Delta-8 selective coating and dispensing system will also be featured to highlight accurate, programmable dispensing capabilities for electronics assembly workflows.
Ginny Hogan, Dymax Business Development Sr. Manager Aerospace & Energy, Global, said, “Electronics manufacturers need both speed and confidence in outcomes, which is why we focus on decreasing assembly times while improving reliability and long-term product performance.”
Technical experts from Dymax will be available to provide guidance on product selection, curing-process design, and reliability considerations for PCB and board-level projects. Dymax is a global manufacturer of light-curing materials and equipment, with its solutions providing performance across avionics, automotive, industrial, and related sectors.
