Dymax, a leading manufacturer of rapid and light-curing materials and equipment, has added the 9773 ruggedizing and staking adhesive to its portfolio of materials engineered for coating, protecting, and securing components on Printed Circuit Boards (PCBs) used in satellites, missiles, and other space applications.
Certified to NASA ASTM E595 Low Outgassing and compliant with MIL-STD-883 Method 5011 Low Ionic Content, Dymax 9773 helps minimize Printed Circuit Board contamination to ensure cleaner boards and improved reliability in the extreme environments of space. The adhesive also meets ASTM E595 with MAPTIS Material Code 09907.
The material’s on-demand UV/Visible light curing capability allows for rapid and flexible PCB processing, eliminating the need for racking, stacking, or extended cure times associated with two-part epoxies. This results in faster throughput and reduced work-in-process.
Dymax 9773 is non-slumping on vertical surfaces for up to 72 hours, jetting-compatible for easy dispensing, and well suited for ruggedizing, staking, and encapsulating PCB components.
Formulated as a one-part, solvent-free, and halogen-free adhesive, 9773 also supports sustainability goals for manufacturers seeking environmentally responsible materials without compromising performance.
