congatec Adopts New COM-HPC Mini Form Factor for Embedded Computing

The new form factor allows platforms such as small UAVs and drones to benefit from the superior bandwidth and interface capabilities of COM-HPC By Mike Ball / 16 Oct 2023

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congatec has confirmed that it will be developing embedded computing products based on PICMG’s (PCI Industrial Computer Manufacturers Group) newly-ratified COM-HPC 1.2 specification, which introduces the COM-HPC Mini form factor.

This new specification provides high-performance capabilities in a small form factor, measuring only 95 mm x 70 mm. Even devices with limited space, such as small UAVs (unmanned aerial vehicles) and drones, can now benefit from the superior bandwidth and interface capabilities of COM-HPC, including PCIe Gen 5 and Thunderbolt.

According to congatec, COM-HPC has established itself as the most scalable Computer-on-Module (CoM) standard, covering a wide range of applications from small form factor designs to edge servers. This simplifies the design process and enables the creation of complete product families with reduced engineering efforts. COM-HPC modules support not only specific processors like x86 or Arm but also FPGAs, ASICS, and AI accelerators, making it a comprehensive standard for developing innovative applications based on the latest embedded and edge data processing technologies.

congatec is committed to supporting the adoption and implementation of the COM-HPC Mini specification, enabling customers to bring their solutions to market quickly. As a leading provider of embedded computing solutions, congatec also continues to develop and deliver products that align with the latest industry standards.

Christian Eder, Chairman of PICMG’s COM-HPC Working Group and Director of Market Intelligence at congatec, commented; “COM-HPC offers the highest performance, bandwidth, interfaces, and scalability compared to other computer-on-module standards and with COM-HPC Mini, engineers can now leverage all this on a real small form factor for space constrained embedded and edge computing designs.”

Posted by Mike Ball Mike Ball is our resident technical editor here at Unmanned Systems Technology. Combining his passion for teaching, advanced engineering and all things unmanned, Mike keeps a watchful eye over everything related to the unmanned technical sector. With over 10 years’ experience in the unmanned field and a degree in engineering, Mike’s been heading up our technical team here for the last 8 years. Connect & Contact

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