Curtiss-Wright’s Defense Solutions Division has introduced the CHAMP-XD4 (VPX6-485), a high-performance, security-enhanced 6U OpenVPX module for compute-intensive aerospace and defense applications such as UAVs (unmanned aerial vehicles) and unmanned systems.
Ideal for the most demanding intelligence, surveillance and reconnaissance (ISR) system architectures, the CHAMP-XD4 features dual Intel Xeon D-2700 processors and can be configured with 12, 16 or 20 cores per device.
The CHAMP-XD4 complements the AMD Versal based CHAMP-FX7 user-programmable Adaptive SoC (FPGA) module. The two modules are the first 6U form factor members of Curtiss-Wright’s new Fabric100 family of SOSA-aligned processing engines, offering customers a powerful board-set specifically designed for the most compute-intensive digital signal processing (DSP) applications, such as multi-mode radar, SAR, SIGINT, EO/IR and EW.
The CHAMP-XD4 is the first Xeon D-2700 module to support four 100GbE fabric connections and 32 lanes of Gen4 PCIe, as well as four banks of memory per processor. This enables customers to take full advantage of the extended core capability of the Xeon D-2700 processors without being restricted by memory or I/O bottlenecks.
To address the increasingly important issue of data security, the CHAMP-XD4 also features an AMD MPSoC FPGA device that provides enhanced TrustedCOTS security functionality. An MPSoC FPGA toolkit is available for applications that require greater design versatility for adding security IP. The toolkit enables integration of advanced security IP, such as Raytheon’s Night Cover product suite and Idaho Scientific’s Immunity cryptography cores. The MPSoC FPGA can also support co-processing and general-purpose I/O requirements via its embedded quad-core Arm A53 processor and dual-core R5 real-time processor.
Aligned with the SOSA Technical Standard, the CHAMP-XD4 supports quad 100 Gigabit Ethernet (GbE) Data Plane interfaces, dual 10 GbE Control Plane interfaces, and 32 lanes of Gen4 PCI Express (PCIe) on the Expansion Plane. The rugged module is available in a conduction-cooled 6U VPX form factor with two-level maintenance covers. The module also supports alternate cooling mechanisms, such as air flow-through (AFT) and liquid flow-through (LFT).