Teledyne FLIR has released development kits for quick integration of the FLIR Hadron 640R thermal and visible dual camera module.
These hardware and reference software drivers are compatible with development boards supporting the NVIDIA Jetson Nano, the Qualcomm RB5, and the Qualcomm Snapdragon 865.
The Hadron 640R features a compact 640×512 resolution radiometric Boson thermal camera module providing the ability to see through total darkness, smoke, most fog, and glare, capturing the temperature of every pixel in the scene. The Boson is paired with a 64MP visible Electro-Optical (EO) camera for high-definition visible imagery.
The new development kits enable integrators to start imaging and controlling the cameras within hours. This helps significantly reduce development time and costs further making it the ideal dual sensor payload for integration into UAS, UGVs, robotic platforms, and AI-ready applications where efficient battery run-time and battery life are mission-critical.
“The powerful Hadron 640R development kits provide integrators industry-leading thermal and visible camera operation using both Linux and Android application development,” said Michael Walters, vice president, product management, Teledyne FLIR. “Combined with the size, weight, and power optimized Hadron 640R and the Teledyne FLIR technical services team to support integration, these development kits further maximize efficiency for developers at every stage.”
With low, steady-state power consumption at 1.8W and an IP-54 rating, the Hadron 640R offers extended battery operation time in a compact, lightweight 56-gram camera module. The plug-and-play development solution allows for same-day operation and comes packaged with interface boards, cabling hardware, and reference software drivers.
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