Drone LiDAR
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Voyant Photonics has introduced the Helium platform, the industry’s first fully solid-state 4D Frequency-Modulated Continuous-Wave (FMCW) LiDAR sensors and modules built on a silicon photonics chip.
The solution utilizes a proprietary Photonic Integrated Circuit (PIC) to deliver a breakthrough architecture designed for high integration and reliability in robotics, industrial automation, and mobile autonomy. By employing a dense two-dimensional photonic focal plane array with fully integrated on-chip beam steering, the system removes the need for moving parts such as MEMS or mirrors. This design enables a compact and rugged module that supports multi-sensor configurations, allowing for the combination of wide and narrow fields of view within a single system.
The hardware is engineered for the emerging era of Physical AI, scaling from core modules to fully enclosed sensors. The high-resolution architecture spans from 12,000 to over 100,000 pixels, providing long-range FMCW performance and per-pixel radial velocity. Because the platform is software-defined, users can implement adaptive scan patterns and specific regions of interest.
Voyant CEO Clément Nouvel said, “Helium represents the next step in our mission to deliver the most affordable high performance LiDAR sensor ever. Industrial and consumer markets demand sensors that are small, cost efficient, and highly reliable. Helium provides all of that while delivering performance that unlocks new classes of intelligent machines.”
The platform is designed to be as small as a matchbox, with a mass of less than 150 grams and a volume under 50 cubic centimeters, making it suitable for drones and compact mobile robots. By using monolithic photonic integration, the system offers a projected 20-fold improvement in Mean Time Between Failures (MTBF) compared to legacy Time-of-Flight (ToF) LiDAR architectures.
Manufacturing for the Helium family leverages the mature photonics foundry ecosystem used by the optical datacom industry. This approach allows Voyant to scale production toward semiconductor-class cost structures while eliminating the complex optical alignments that often hinder traditional LiDAR manufacturing.
The technology extends the foundation of the company’s Carbon product line, moving from 1D to 2D on-chip beam steering. This evolution allows OEMs to integrate sensing technology directly into machines via module-only access. The sensors will be available in various resolution and range configurations, with field-of-view options ranging from long-range optics to ultra-wide coverage approaching 180 degrees.
Voyant is currently opening an early access program for select automation partners and OEMs to explore custom chip resolutions and multi-sensor fusion architectures. The first prototype of the Helium platform is scheduled for demonstration at CES 2026 in Las Vegas.
