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Infrared sensor and measurement technology company InfraTec has announced an upcoming online event titled, “Thermography and Digital Image Correlation – A Winning Team in Electronics and Other Applications.”
The event is scheduled for Wednesday, September 5, 2024, from 10:00 AM to 12:00 PM (CEST) and will feature technical lectures, including, “Heat & Measure – ARAMIS 3D-Deformation and Thermography for Testing Applications.”
Event Topics
In materials testing, combining various methods often yields the most accurate results. Infrared thermography, for instance, is most effective when used alongside other techniques. This approach allows for the simultaneous analysis of mechanical deformations and thermal reactions of material samples and components.
The ARAMIS system by ZEISS/GOM, which employs digital image correlation (DIC), is an ideal tool for such analyses. When combined with thermographic measurements from InfraTec’s infrared cameras, this method provides a comprehensive view of both the thermal and mechanical behaviors of test specimens.
This integrated approach enables in-depth analysis of materials such as metals, plastics, composites, and electronic power components.
ARAMIS’s specialized software further enhances this capability by allowing detailed examination of the relationship between mechanical deformations and thermal behavior.
This results in a better understanding of materials or components and can significantly reduce development time. To explore how these advanced techniques can benefit your work, register for the informative event.
Key Details:
Speaker: Burak Acun, ZEISS Industrial Quality Solutions Carl Zeiss GOM Metrology GmbH
Date: Wednesday, 5 September 2024 / Time: 10:00 AM – 12:00 PM (CEST)
