In the field of materials testing, numerous methods have been established including infrared thermography. Often, it is the combination of different methods that enables the desired results for component characterisation. For example, you can analyse displacements and mechanical deformations of material samples and components parallel with its thermal reaction.
In this online event you will learn how to use digital image correlation (DIC) and thermography for the simultaneous analysis of the thermal and mechanical behaviour of test specimens in the materials and components testing field.
• Active thermography for non-destructive testing
• Synchronising high-tech sensors: ZEISS/GOM ARAMIS and infrared cameras from InfraTec
• Tracking of temperature on homologous points in 3D space
• Applications in materials, components and electronic testing
Burak Acun, ZEISS Industrial Quality Solutions
Carl Zeiss, GOM Metrology GmbH
Date and time:
6th September 2023 – 9:00 – 11:00 (UTC)