Industrial I/O and embedded computing solutions manufacturer Sealevel Systems will premier its newest solutions at Embedded World 2023, March 14-16 in Nuremberg, Germany.
Conversations and presentations at Embedded World will explore the multifaceted world of embedded systems – from hardware and software to services and tools.
Featured Sealevel products at Embedded World include the following solutions:
- 12009 COM Express Compact Type 6 Carrier Board
At 95 millimeters square, the 12009 Compact Type 6 Carrier Board is identical in size to a Compact Type 6 COM Express module and is believed to be the smallest-in-industry Type 6 carrier board. Designed to meet a wide variety of application needs, the 12009 evaluation board supplies a diverse I/O mix and robust processing support.
- HazPAC 10 Rugged Panel PC
The HazPAC 10 Rugged Panel PC is a touchscreen solution for hazardous locations in both commercial and defense applications. The HazPAC 10 features a fanless industrial computer with a wide -40°C to 60°C operating temperature. For the most intense environments, the HazPAC 10 has a NEMA 4/IP64 front bezel and is certified by ATEX, IECEx, and for Class I, Division 2 (Groups A, B, C, D, T4). Available with an 8.4” or 15” five-wire resistive touchscreen, the HazPAC 10 is perfect for a wide variety of control and HMI applications.
- Embedded SuperSpeed USB 3.1 Hubs
Sealevel’s Embedded SuperSpeed USB 3.1 Hubs for OEM applications achieve SuperSpeed operation and meet the requirements to supply 1500mA per port simultaneously. The hubs feature expansive ESD protections and an industry-leading -40°C to 85°C operating temperature, as well as backward compatibility with legacy peripherals. USB hubs that maintain reliable operation when subjected to environmental extremes have been difficult to source – these 4-port and 7-port USB 3.1 hubs from Sealevel are the most viable option available.
Embedded World attendees are invited to visit the Sealevel team at Hall 3, Booth 359 for hands-on demonstrations.
