A Glimpse at the Online Event
- Failure analysis and defect inspection
- Quality and process control
- Flexible R&D solution
- Basic configuration to turnkey solution
- Hotspot detection on printed circuit boards, integrated circuits, semiconductor material and multi-chip modules
- Detection of faulty thermal connections of heat sinks, short circuits, soldering defects and wire bonding errors
Technical Lecture from Thermography Practice
“Challenges and Applications of Thermography in Microelectronics”
Speaker: Marko Hoffmann, Infineon Technologies Dresden GmbH & Co. KG
