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High-Performance Adhesive Solutions for Drone Assembly & Manufacturing
LOCTITE® EA 9496 Two-component low-shrinkage epoxy potting resin system with high thermal conductivity
LOCTITE® EA 9496

Two-component low-shrinkage epoxy potting resin system with high thermal conductivity

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LOCTITE® EA 9496

LOCTITE® EA 9496, also known as Hysol Adhesive 9496, is a two-component, room-temperature curing, low-shrinkage epoxy potting resin system. The product combines low shrinkage during cure with high thermal conductivity, making it suitable for low-stress applications such as potting electronic components.

The mixed adhesive forms a black opaque paste and develops complete cure after three days at room temperature. It achieves handling strength in 6-7 hours at 22 deg C, with elevated temperatures available to accelerate cure where required by the process.

Specifications:

Product type Two-component room-temperature curing epoxy potting resin system
Resin chemical type Epoxy
Hardener chemical type Amine
Mixed appearance Black opaque paste
Mix ratio by volume 6:1 resin/hardener
Mix ratio by weight 100:7 resin/hardener
Maximum gap fill 1 mm
Working life at 22 deg C, 100 g mix 120 min
Fixture time at 22 deg C 6-7 hours
Complete cure at room temperature 3 days
Thermal conductivity coefficient 1.7 W/m.K
Tensile strength 67 N/mm2
Compressive strength 96 N/mm2
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