Light-Curable Adhesives, Conformal Coatings, and Maskants for Circuit Boards, Electronic Assemblies & Camera Modules
9803 Active Alignment Epoxy with Very Low Shrinkage Fast-curing solvent-free epoxy adhesive for camera modules & optical assemblies
9803 Active Alignment Epoxy with Very Low Shrinkage

Fast-curing solvent-free epoxy adhesive for camera modules & optical assemblies

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9803 Active Alignment Epoxy with Very Low Shrinkage

Dymax 9803 one-part adhesive features low volumetric shrinkage (1.5%) for precise active alignment and bonding of camera modules, LiDAR, and optical components. The material cures in seconds with UV/Visible or LED light and features a low-temperature (80-85°C) heat-cure function for areas where shadow areas are present.

The eco-friendly epoxy is ideal for complex alignment and positioning applications such as lens bonding, bonding lens barrels to holders, or bonding holders to PCBs. 9803 adhesive has been tested to NASA ASTM E595 low outgassing standard and meets the TML and CVCM thresholds historically used as screening for spacecraft materials. The product follows RoHS directives 2015/863/EU.