9801 Low-Shrink Camera Module Epoxy
Dymax 9801 is a single-component formulation used for precisely aligning camera and LiDAR modules and other optical assemblies. The material is moisture- and thermal-cycle resistant and meets the stringent low-shrinkage requirements introduced for active alignment applications.
The epoxy cures primarily with UV/Visible light in seconds and includes a low-temperature heat-cure capability for components with shadow areas. It is suitable for bonding LCP, PCB, PPS, FPC, CAP, PS, FR-4 board, and glass substrates. Dymax 9801 adhesive has been tested to NASA ASTM E595 low outgassing standard and meets the TML and CVCM thresholds historically used as screening for spacecraft materials. The product follows RoHS directives 2015/863/EU.